This site uses cookies. By continuing to browse the site you are agreeing to our use of cookies. Read our privacy policy

Corporate Worldwide Log in

Back to Main Menu

Huawei Websites

Corporate: Corporate news and information

Consumer: Phones, laptops, tablets, wearables & other devices

Enterprise: Enterprise products, solutions & services

Carrier: Products, solutions & services for carrier networks

Huawei Cloud: Cloud products, solutions & services

Select a Country or Region

About Huawei

Outstanding Debt Instruments

Huawei has international bond market funding programme (Medium Term Note).

International Bond Market Funding Programme

Notice of listing on HKEX
Type of programme	Euro Medium Term Note programme
Programme size	US$5.0 billion
Issuer	Proven Glory Capital Limited
Guarantor	Huawei Investment & Holding Co., Ltd.
Establishment date	09/02/2017
Programme documents last update as of	17/04/2018
	HKEX Notice in Apr 2018
	HKEX Notice in Aug 2017
	HKEX Notice in Feb 2017

Offshore Outstanding Bonds

ISIN	Currency	Issue size	Pricing date	Maturity date	Notice of listing on HKEX
XS1567423501	USD	US$1,000,000,000	14/02/2017	21/02/2022	HKEX Notice in Feb 2017 HKEX Notice in Dec 2018 HKEX Notice in Mar 2019 HKEX Notice in May 2019 HKEX Notice in Aug 2019 HKEX Notice in Mar 2020 HKEX Notice in May 2020 HKEX Notice in Nov 2020
XS1233275194	USD	US$1,000,000,000	12/05/2015	19/05/2025	HKEX Notice in May 2015 HKEX Notice in Dec 2018 HKEX Notice in Mar 2019 HKEX Notice in May 2019 HKEX Notice in Aug 2019 HKEX Notice in Mar 2020 HKEX Notice in May 2020 HKEX Notice in Nov 2020
XS1401816761	USD	US$2,000,000,000	28/04/2016	06/05/2026	HKEX Notice in Apr 2016 HKEX Notice in Dec 2018 HKEX Notice in Mar 2019 HKEX Notice in May 2019 HKEX Notice in Aug 2019 HKEX Notice in Mar 2020 HKEX Notice in May 2020 HKEX Notice in Nov 2020
XS1567423766	USD	US$500,000,000	14/02/2017	21/02/2027	HKEX Notice in Feb 2017 HKEX Notice in Dec 2018 HKEX Notice in Mar 2019 HKEX Notice in May 2019 HKEX Notice in Aug 2019 HKEX Notice in Mar 2020 HKEX Notice in May 2020 HKEX Notice in Nov 2020

Debt Financing Instruments (DFI) in the Interbank Market of China

Issuer	Huawei Investment & Holding Co., Ltd.
Period of Validity	23/04/2020-23/04/2022

Onshore Outstanding Bonds

Bond Code	Bond English Short Name	Currency	Issue Size	Value Date	Maturity Date
101901415	19 HUAWEI MTN001	CNY	¥3,000,000,000	24/10/2019	24/10/2022
101901525	19 HUAWEI MTN002	CNY	¥3,000,000,000	07/11/2019	07/11/2022
102000247	20 HUAWEI MTN001	CNY	¥2,000,000,000	06/03/2020	06/03/2025
102000446	20 HUAWEI MTN002	CNY	¥2,000,000,000	23/03/2020	23/03/2025
102000812	20 HUAWEI MTN003	CNY	¥2,000,000,000	24/04/2020	24/04/2025
102001259	20 HUAWEI MTN004	CNY	¥3,000,000,000	24/06/2020	24/06/2023