Chaspark: An Academic Exchange Platform for Global Top STEM Talent
Chaspark is a world-class platform for academic exchanges on science and technology. The platform attracts and connects outstanding talent from different disciplines, colleges, and regions, and aims to drive scientific and technological advances. The platform, which focuses on the ICT industry, provides access to insightful papers, real-world challenges, and technical contests, and organizes technical exchange activities and discussions on trending academic topics. This helps domain experts, scholars, and researchers from both academia and industry discuss and explore the latest technical challenges together.
World-class challenges help cultivate world-class talent, and open innovation lights the way forward for the industry. Since November 2022, Huawei has been publishing real-world challenges on Chaspark that have both commercial and scientific value. We have promoted cooperation between schools and enterprises to quickly and accurately align academic research with industry requirements. This has encouraged researchers to make progress in theoretical research, helped them better understand the cutting-edge technology challenges facing the industry, and inspired schools to develop talent which will meet future needs of the industry. Chaspark has also posted top technology competitions organized by Huawei around the world, enabling young talent from universities, scientific research institutes, and other institutions to quickly and easily learn about industry needs in real-world scenarios and identify research directions.
Chaspark remains committed to providing an open, cutting-edge, and innovative exchange and learning community for academic and talent development. We hope that STEM talent from around the world will spark inspiration and generate new ideas on this platform.
Chaspark website: https://www.chaspark.com/#/home?lang=en
Chaspark offers a variety of activities for researchers to inspire innovation and promote industry-academia collaboration
