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Huawei Launches New-Generation HPC Platform FusionServer X6000 at SC16

NOV 16, 2016

Huawei will provide enterprise customers with an HPC platform that has higher efficiency and greater flexibility

[Salt Lake City, U.S.A., November 15, 2016] Huawei launched a new-generation high-performance computing (HPC) platform, the FusionServer X6000, at the Supercomputing Conference 2016 (SC16).

This FusionServer X6000 will aid computing-intensive workloads and provide enterprise customers with an ideal choice for an HPC platform that has higher efficiency and greater flexibility.

“Faced with the challenges of digital transformation, enterprises are eager for service reconstruction, which drives the convergence of traditional HPC and cutting-edge technologies such as cloud computing and Big Data,” said William Dong, Vice President of Data Center Solution Sales, Huawei Enterprise BG.

"With outstanding R&D capabilities and comprehensive product portfolios in the IT domain, Huawei joins hands with industry partners to build joint innovation centers around the globe. We are dedicated to providing our customers IT infrastructures with leading technologies, as well as innovative HPC cloud, HPC, and Big Data solutions to help customers achieve business success.”

The X6000 HPC platform adopts an industry-leading and innovative liquid cooling solution, which features a skive fin micro-channel heat sink for CPU heat dissipation and processing technology where water flows through memory modules. The platform delivers a node liquid cooling percentage greater than 85%. Its modular design and 50ºC warm water cooling function offers customers high energy-efficiency and flexible deployment, and reduces total cost of ownership (TCO) by up to 40% for large-scale deployment.

The platform also accommodates four 2-socket server nodes in a 2U chassis and presents an outstanding all-flash storage capability of 24x NVMe SSDs per chassis. Based on the high bandwidth and low latency features of 100 Gbps networks, the X6000 HPC platform can achieve a single-node throughput of 4.8 million IOPS.

The FusionServer X6000 launch ceremony

As an important partner of Huawei in the IT domain, Intel was invited to join and witness the launch of Huawei FusionServer X6000.

“Huawei’s new-generation FusionServer X6000 HPC platform, based on the Intel® Scalable System Framework, provides the balanced performance, scalability, and flexibility to efficiently handle a wide range of HPC workloads,” said Hugo Saleh, Director of Marketing and Enabling, Intel Scalable Datacenter Solutions. “The FusionServer X6000 is a great example of how Intel® Xeon® processors and Intel® Omni-path architecture can combine to build industry leading solutions with innovative fabric features that optimize performance, resiliency, and traffic movement.”

Huawei is showcasing its HPC solutions for industry scenarios at SC16. Among the HPC solutions on show are Huawei’s high-density servers FusionServer E9000 and X6800 with 100G high-speed interconnect technology and powerful cluster scalability. These servers can dramatically accelerate industrial CAE simulation. Huawei is also displaying its KunLun supercomputer, which features the company’s proprietary Node Controller interconnect chips. KunLun supports up to 32 CPUs and is perfect for cutting-edge research scenarios that require frequent in-memory computing. Additionally Huawei’s high-performance storage solutions, OceanStor 9000 and ES3000 SSD, which can effectively improve data transmission bandwidth and latency, are on display.

A series of other milestones and achievement’s based on Huawei’s cooperation with industry partners were also announced (or demonstrated) during SC16:

Huawei has increasingly become more prominent in the HPC market. It has successfully deployed HPC clusters for a large number of global vehicle producers, large-scale supercomputing centers, and research institutions. These show that Huawei’s HPC platforms are optimized for industry applications which can help customers significantly simplify service processes and improve work efficiency, enabling them to focus on product development and research.